The Road to 64G UCIe IP: What Designers Need to Know ARTICLE Oct 13, 2025/5 min read ARTICLE The Road to 64G UCIe IP: What Designers Need to Know By Aparna Tarde Tags: Multi-Die, Interface IP, Silicon IP
Sima and Synopsys Enable Multi-die based ADAS and IVI Applications ARTICLE Jul 17, 2025/6 min read ARTICLE Sima and Synopsys Enable Multi-die based ADAS and IVI Applications By Ron DiGiuseppe Tags: Multi-Die System, Silicon IP Technical Bulletin, Consideration, Automotive
Key Considerations for Chiplet Designs From Idea to Product ARTICLE Jul 17, 2025/7 min read ARTICLE Key Considerations for Chiplet Designs From Idea to Product By Rob Kruger Tags: Multi-Die System, Silicon IP Technical Bulletin, Consideration, Silicon IP
Enabling Industry NoC Interconnects with UCIe IP ARTICLE Apr 22, 2025/10 min read ARTICLE Enabling Industry NoC Interconnects with UCIe IP By Aparna Tarde Tags: Multi-Die System, Silicon IP Technical Bulletin, Interface IP, Silicon IP
IP for 3D Multi-Die Designs ARTICLE Jan 15, 2025/8 min read ARTICLE IP for 3D Multi-Die Designs By Rob Kruger Tags: Multi-Die, Silicon IP Technical Bulletin, Interface IP, Silicon IP
Synopsys 3DIO Solution for Multi-Die Integration (2.5D/3D) ARTICLE Apr 15, 2024/7 min read ARTICLE Synopsys 3DIO Solution for Multi-Die Integration (2.5D/3D) By Lakshmi Jain, Wei-Yu Ma Tags: Multi-Die, Silicon IP Technical Bulletin, Silicon IP
How Technology and Workloads are Driving Multi-Die Systems ARTICLE Jul 17, 2023/9 min read ARTICLE How Technology and Workloads are Driving Multi-Die Systems By Ron Lowman Tags: Multi-Die, Silicon IP Technical Bulletin, Silicon IP
Leveraging UCIe IP for Multi-Die System Reliability ARTICLE Apr 17, 2023/8 min read ARTICLE Leveraging UCIe IP for Multi-Die System Reliability By Manuel Mota Tags: Multi-Die, Silicon IP Technical Bulletin, Interface IP, Silicon IP
Unpacking the Rise of Multi-Die SoCs with UCIe ARTICLE Jul 17, 2022/8 min read ARTICLE Unpacking the Rise of Multi-Die SoCs with UCIe By Manuel Mota Tags: Multi-Die, Silicon IP Technical Bulletin, Interface IP, Silicon IP
What Designers Need to Know About HBM3 ARTICLE Apr 16, 2022/8 min read ARTICLE What Designers Need to Know About HBM3 By Brett Murdock Tags: Multi-Die, Data Center, AI & Machine Learning, Silicon IP Technical Bulletin, Interface IP, Silicon IP