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4 min read / Dec 02, 2025

New Fujitsu Chip to Power Greener, Smarter Data Centers

Greg Sorber

By Greg Sorber

Tags: Multi-Die, Debug, Simulation, Emulation, About Synopsys, Energy-Efficient SoCs, Customer Spotlight, Data Center, Design, 5nm and Below, HPC, Data Center, Verification, 3DIC Design

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Blog

3 min read / Nov 25, 2025

Adapting Foundation IP to Exceed 2 nm Power Efficiency in Next-Gen Hyperscale Compute Engines

Andrew Appleby

Daryl Seitzer

By Andrew Appleby , Daryl Seitzer

Tags: Data Center, Fusion Technology, Design, Fusion Design Platform, About Synopsys, 5nm and Below, Energy-Efficient SoCs, Foundation IP, HPC, Data Center, Silicon IP

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Blog

4 min read / Nov 12, 2025

Engineering Physical AI

Thomas Andersen

By Thomas Andersen

Tags: Executive Voices, AI & Machine Learning, Design, About Synopsys

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Blog

5 min read / Nov 06, 2025

10 Tips for First-Pass Silicon Success in AI Chip Development

Rita Horner

Todd Koelling

Frank Schirrmeister

By Rita Horner , Todd Koelling , Frank Schirrmeister

Tags: Multi-Die, AI & Machine Learning, Test, Emulation, About Synopsys, Physical Implementation, Signoff, Virtual Prototyping, Engineering Central, Silicon Lifecycle Management, Design, HPC, Data Center, Silicon IP, Verification

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Blog

3 min read / Nov 04, 2025

How Multi-Die Designs Boost Automotive Chip Innovation

Sajani Patel

Hezi Saar

By Sajani Patel , Hezi Saar

Tags: Multi-Die, Silicon Lifecycle Management, Design, About Synopsys, Physical Implementation, Automotive, Silicon IP, Verification, Virtual Prototyping, 3DIC Design

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Blog

1 min read / Oct 29, 2025

Adapt or Fall Behind: The Critical Need for Engineers to Master AI Technologies

John Koeter

By John Koeter

Tags: Executive Voices, AI & Machine Learning, Design, About Synopsys

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Blog

5 min read / Oct 23, 2025

How AI is Supercharging Chip Design Workflows

Shankar Krishnamoorthy

By Shankar Krishnamoorthy

Tags: Executive Voices, AI & Machine Learning, Design, About Synopsys

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Synopsys Blogs

Recent Stories

New Fujitsu Chip to Power Greener, Smarter Data Centers

Adapting Foundation IP to Exceed 2 nm Power Efficiency in Next-Gen Hyperscale Compute Engines

Engineering Physical AI

10 Tips for First-Pass Silicon Success in AI Chip Development

How Multi-Die Designs Boost Automotive Chip Innovation

Adapt or Fall Behind: The Critical Need for Engineers to Master AI Technologies

How AI is Supercharging Chip Design Workflows

Connect with Us

Search Synopsys

Popular Content

Innovate Faster with Synopsys Multi-Die Solution

Explore our eBook for scalable multi-die solutions to boost innovation, productivity, and success.

Automotive Executive Guide: Rethinking Automotive Development

A guide to virtualization in software-defined vehicles for automotive leaders.

Mastering AI Chip Complexity

This eBook explores AI chip design trends, challenges, and strategies for first-pass silicon success.

Synopsys Blogs

Recent Stories

New Fujitsu Chip to Power Greener, Smarter Data Centers

Adapting Foundation IP to Exceed 2 nm Power Efficiency in Next-Gen Hyperscale Compute Engines

Engineering Physical AI

10 Tips for First-Pass Silicon Success in AI Chip Development

How Multi-Die Designs Boost Automotive Chip Innovation

Adapt or Fall Behind: The Critical Need for Engineers to Master AI Technologies

How AI is Supercharging Chip Design Workflows

Connect with Us

This eBook explores AI chip design trends, challenges,
and strategies for first-pass silicon success.