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Smart card contact-based controller modules

We offer field-proven, plug-and-play packaging technology for high-performing contact-based smart cards

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Overview

Our contact-based packages meet all security and robustness requirements for smart cards while also improving contact-based card designs. Supporting lean production processes and very fast ramp-up, these packages also enable simplified, secure supply chains.

Key Features

  • High robustness
  • 10 years' lifetime
  • Flexible card construction
  • Proven technology

Products

About

Our flip chip on substrate (FCOSTM) technology is an easy way to integrate chips into cards. Thin modules (420 μm) pave the way for flexible and imaginative card designs.

We complement our chips and modules with a variety of services. Our experts are happy to support customers, for example, with reliability testing and failure analysis for their cards.

Billions of our modules and packages are deployed by customers who demand the highest quality standards.

Our flip chip on substrate (FCOSTM) technology is an easy way to integrate chips into cards. Thin modules (420 μm) pave the way for flexible and imaginative card designs.

We complement our chips and modules with a variety of services. Our experts are happy to support customers, for example, with reliability testing and failure analysis for their cards.

Billions of our modules and packages are deployed by customers who demand the highest quality standards.

Design resources

Developer community

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