Open-source Framework for HPCA2024 paper: Gemini: Mapping and Architecture Co-exploration for Large-scale DNN Chiplet Accelerators
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Apr 28, 2025 - C++
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SV/DPI library allowing multiple simulations/platforms to run in parallel and communicate
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Feb 24, 2026 - SystemVerilog
Multi-Objective Hardware-Mapping Co-Optimisation for Multi-DNN Workloads on Chiplet-based Accelerators
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Jul 30, 2024 - C++
Easy-to-use characterization framework for 2.5D chiplet links
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Aug 10, 2026 - Python
UniCNet is a cycle-accurate simulator supporting effienct simulation for composable chiplet networks.
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Jan 29, 2026 - C++
A curated list of semiconductor industry resources, with a deliberate bias toward sub-10nm logic, lithography, process technology, and advanced packaging.
awesome asic packaging eda awesome-list vlsi lithography hbm semiconductor photonics tcad semiconductors 3d-ic euv open-source-eda chip-design chiplet advanced-packaging heterogeneous-integration process-technology
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Aug 18, 2026
True 3D Global Placement GUI Viewer -- An interactive 3D visualization demo for 3D IC placement. Built for the era of Huawei's Tao (τ) Law and Logic Folding, where 3D placement becomes the key enabler for next-generation chip density beyond Moore's Law.
threejs eda huawei 3d-visualization 3d-ic global-placement chip-design chiplet hybrid-bonding advanced-packaging logic-folding tau-law moore-law placement-viewer
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May 26, 2026 - HTML
Physics-informed thermal surrogate benchmark for 3D/2.5D IC packaging — PINN, FNO/WHNO, PI-DeepONet, and autoregressive operators trained on real 3D-ICE ground truth across 8 geometries (single-die, TSV stacks, chiplets, CoWoS+HBM).
pytorch pinn 3d-ic explainable-ai foundation-models chiplet cowos operator-learning deeponet fourier-neural-operator ic-packaging chip-thermal-anlysis
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Jul 3, 2026 - Python
ОТКРЫТЫЙ КОНЦЕПТ x128/x512 Микроэлектроника зашла в тупик нанометров . Концепт решает проблему расширением регистров и сокращением тактов. Вместо 4–8 шагов x64, логика x128/x512 обрабатывает массивы (ИИ, криптография) за 1–2 такта. Реализация: чиплеты через UCIe и софтверный JIT для совместимости с x86. Безвозмездно передаю идею человечеству.
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Jul 10, 2026
Foundry/IP Decision Intelligence — 10 RSS → RAW (immutable) → NORMALIZED → DEDUPE → EVENTS (EID_v0.1) → GATE → RIT_v0.2 → Decision Signals → Weekly Brief → Email. No LLM, provenance-first.
supply-chain google-sheets eda google-apps-script vlsi foundry hbm semiconductor ip-core chiplet decision-intelligence advanced-packaging
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Sep 3, 2026 - JavaScript
Thermal-aware ChipletPart: cost, technology, floorplan, and predicted-temperature co-optimization for 2.5D chiplets.
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Jul 15, 2026 - C++
Hard Constraint Projection enhanced neural operator with hybrid sampling for chiplet thermal analysis (Microelectronics Reliability 2026)
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Aug 4, 2026 - Python
DeepOHeat with legacy and package-level thermal surrogate adapters for Thermal-ChipletPart.
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Jul 15, 2026 - Python
Thermal-aware cost and technology co-optimization for early 2.5D chiplet partitioning with DeepOHeat.
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Jul 15, 2026
免费开源的中文半导体与先进封装课程:40 课,覆盖 Chiplet、HBM、2.5D/3D、工程约束、制造经济学与产业研究。
github-pages education electronics hbm semiconductor power-integrity signal-integrity thermal-management open-courseware 3d-integration 2-5d chiplet cowos ucie advanced-packaging chinese-course semiconductor-education semiconductor-packaging heterogeneous-integration
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Sep 1, 2026 - HTML
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