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Full detail: Where this data comes from
Amkor Technology is the world's largest US-based provider of outsourced semiconductor packaging and test services (OSAT), serving integrated device manufacturers, fabless semiconductor companies, and contract foundries. The company offers advanced packaging technologies including flip chip, wafer-level packaging, 2.5D/3D TSV, System-in-Package, and chiplet integration solutions for AI, automotive, communications, computing, consumer electronics, industrial, IoT, and networking markets.
Run: Capabilities Using Naftiko
- Semiconductor Packaging, OSAT, Test Services, Advanced Packaging, Chiplets, Automotive, Artificial Intelligence, Electronics Manufacturing
- Created: 2024年01月01日
- Modified: 2026年04月19日
Amkor Technology provides outsourced semiconductor packaging and test services for chip manufacturers worldwide. The company does not currently publish a public developer API.
Human URL: https://www.amkor.com
- Semiconductor Packaging, OSAT, Test Services
| Name | Description |
|---|---|
| Laminate Packaging | Advanced laminate packages including CABGA, FBGA, fcCSP, FlipStack CSP, and interposer solutions for high-performance semiconductor devices. |
| Leadframe Packaging | Leadframe-based packages including LQFP, TQFP, SOIC, SSOP, and fcMLF for cost-optimized semiconductor packaging. |
| Wafer-Level Packaging | WLCSP and WL3D wafer-level packaging for compact, high-performance semiconductor packages with minimal form factor. |
| Advanced 2.5D and 3D Packaging | Through-silicon via (TSV) technology for 2.5D and 3D stacked die configurations enabling high-bandwidth interconnects for AI and HPC applications. |
| System-in-Package | SiP integration combining multiple chips, passives, and sensors into a single package for IoT, wearables, and complex electronic systems. |
| Chiplet Integration | Proprietary S-Connect and S-SWIFT technologies for advanced chiplet integration enabling heterogeneous integration of multiple die from different foundries. |
| Power Discrete Packaging | Power semiconductor packages including D2PAK, DPAK, PowerCSP, and PQFN for power management and motor control applications. |
| Memory and Sensor Packaging | Specialized packaging for MEMS, image sensors, memory modules, and other sensor devices requiring precision assembly. |
| Semiconductor Testing | Comprehensive semiconductor test services including wafer test, final test, and burn-in for quality assurance and yield optimization. |
| Name | Description |
|---|---|
| AI and High-Performance Computing | Advanced 2.5D/3D packaging and chiplet integration for AI accelerators, data center GPUs, and high-performance computing applications. |
| Automotive Electronics | Automotive-grade semiconductor packaging for ADAS, electrification, infotainment, and powertrain control modules meeting AEC-Q100 standards. |
| 5G Communications | RF and mmWave packaging solutions for 5G base stations, smartphones, and infrastructure equipment requiring high-frequency performance. |
| Consumer Electronics | Cost-optimized packaging for smartphones, tablets, wearables, and consumer devices with compact form factors and high integration. |
| Industrial and IoT | Robust semiconductor packages for industrial automation, sensors, and IoT devices requiring wide operating temperature ranges. |
| Memory Packaging | DRAM, NAND flash, and memory module packaging for storage and memory applications in enterprise and consumer markets. |
| Name | Description |
|---|---|
| Foundry Partners | Collaboration with leading semiconductor foundries including TSMC, Samsung, and GlobalFoundries for seamless wafer-to-package supply chain integration. |
| EDA Tool Providers | Integration with electronic design automation tools for package design, thermal simulation, and signal integrity analysis. |
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