・ Electroplating Various.

・Electroless plating Various.

・Dispersive plating. (Diamond dispersion,Fluororesin,Boro,Silica,and Other.)

・Coppe and Nickel Precision electroforming.

・Chemical conversion processing. (Aluminum conversion coating treatment,Manganese phosphate treatment, and Other)

・Anodization. (Alumite)

・Printed circuit board through-hole plating.

・Continuous partial plating. (Lead frame and Other.)

・Procoat processing.

・Smear removal process.

・BO processing.

・Electrodeposition painting. (Anion,Cation)

・Washing Various.