Registration: Go to DATE 2006 registration site and select either the entire conference or Friday Workshop W2.
Accommodation: Go to DATE 2006 accommodation site .
Advances in semiconductor technology, design re-use and tools are enabling
designers to put complex, massively parallel multiprocessor systems on a
single chip. The idea of packet-switching Networks on a Chip (NoC) offers more flexibility, robustness and better
resource utilisation than what is provided by
traditional bus-based architectures. NoCs are poised to be an alternative to
buses, but should they rather be seen complementary than alternative in the
longer term? What kind of new communication paradigms and signaling schemes
are more suited for NoCs in order to battle inherent signal integrity and
soft errors? Are there fundamental issues about on-chip interconnects that
will limit performance and dependability of communication as
These and other questions will be in the centre of this workshop, which will bring together researchers actively working on future interconnects and NoCs. The workshop is also keen to invite hardware and system engineers interested in new developments in this area. In a final panel, experts in the field will address the challenges and opportunities for on-chip interconnect paradigms and project their vision on the current developments in academic and industrial research.
The workshop will serve to launch a new series of high quality symposia, targetted at Networks on Chip and Interconnects. The need for such a dedicated forum is increasingly recognised due to the steady growth in research activity and contributions that are currently spread over multiple conferences in diverse areas such as architecture, circuits, CAD and networking. It will also provide an excellent thematic framework for interaction between industry and academia.
Links:
Workshop Goal
To discuss problems and opportunities, present points of view and develop
collective vision for the future of on-chip interconnects and communications
To survey research by the leading research groups working in this area around
the world
To plan a new international symposium on NoCs and interconnects.
Workshop Program
08:30
Welcome and Introduction
08:45-09:15
Keynote: NoCs:
Vision, reality, trends
Luca Benini, DEIS -
09:20-10:00
Session 1: Advances
in NoCs (invited presentations)
Chair: Ran Ginosar,
キ
Networks and Applications: Are Application-Specific Networks Worth
the Trouble?
Wayne Wolf, Princeton
U,
10:00-10:20
BREAK
10:20-11:00
Session 2: Advances
in On-Chip Interconnects (invited presentations)
Chair: Pol Marchal,
IMEC,
キ
Potential impact of emerging System-in-Packaging technologies on
system design
Eric Beyne, IMEC,
11:00-12:00
Introducing Research Groups
Chair:
Presenters:
12:00-13:00
LUNCH
13:00-14:30
Poster Session
This session will enable direct interactions among all researchers. Its goals are to get to know each other and each other's work, and to create opportunities for research collaborations.
M. Saleh and Axel Jantsch
Royal
Z. Lu, M. Zhong and A. Jantsch
Royal Institute of
K. Peters駭1, J. ヨberg1,
1 Royal
Institute of Technology (KTH),
2 University
of South Brittany,
I. Al Khatib
Royal
I. Al Khatib1, A. Jantsch1, R. Nabiev2 and L. O. Alima3
1 Royal
Institute of
2
3 Universit? de
X. Ru1, J. Dielissen2, C. Svensson3 and K. Goossens2
1 Philips
Semiconductors,
2 Philips Research,
The
3 Link?ping
University,
T. Bengtsson1,
1 J?nk?ping University,
2
D. Andreasson and S. Kumar
R. Holsmark and S. Kumar
R. Pop and S. Kumar
H, Kariniemi and J. Nurmi
H. Kariniemi and J. Nurmi
X. Wang and J. Nurmi
T. Ahonen, J. Kylli臺nen, C. Brunelli and Jari Nurmi
Tampere University of Technology, Finland
T. Ahonen and J. Nurmi
T. Ahonen, D. Sig?enza-Tortosa * and J. Nurmi
* Complutense
University of Madrid,
S. M蒿tt? and J. Nurmi
T. Ahonen, H. Bin and J. Nurmi
P. Vivet, F. Clermidy, D. Lattard
G. Roelkens1, J. Van
Campenhout1, D. Van Thourhout1, R. Baets1, P. Rojo-Romeo2, C. Seassal2, P.
Regreny2, P. Viktorovitch2,
1
2 Ecole Centrale de Lyon
3 CEA-DRT/LETI
I. O’Connor1, F. Tissafi-Drissi1, D. Navarro1, F. Mieyeville1, F. Gaffiot1, J. Dambre2, M. De Wilde2, D. Stroobandt2 and D. Van Thourhout3
1 Ecole
2
3 IMEC /
P. Martin and J. Lecler
Arteris SA, France
S. Evain and J. Diguet,
C. Koch-Hofer and M. Renaudin
TIMA, France
M. Coppolaケ, C. Pistrittoイ, R. Locatelliケ and Alberto Scndurraイ
ケ STM, AST Grenoble Lab, France
イ STM, HPC, Italy
M. Stensgaard1, T. Bjerregaard1, J. Spars?1 and J. Pedersen2
1 Technical
University of
2 William Demant Holding
T. Bjerregaard, J. Spars? and M. Stensgaard
Technical
C. D'Alessandro1, D. Shang1, A. Bystrov1, A. Yakovlev1, O. Maevsky 2
1 University of
Newcastle upon Tyne,
2 Intel Labs,
J. Zhou, D. Kinniment, G. Russell, and A. Yakovlev
J. Bainbridge, A. Bardsley and R. McGuffin,
A. Banerjee, R. Francis, J. Lee, J. May, S. W. Moore and R. D. Mullins
Computer Laboratory,
C. Grecu11, P. Pande2, A. Ivanov1 and R. Saleh1
1 University of
2
S. Sood, M. Greenstreet and R. Saleh
P. Pande and J. Nyathi
Z. Asgar, J. Zou, P. Jain, R. Kamath and R. Harjani
A. Pinto, L.P. Carloni and A.L. Sangiovanni-Vincentelli
U.C.
J. Xu and W. Wolf
V. Soteriou, N. Eisley, H. Wang, B. Li and L. Peh
U. Ogras and R. Marculescu
J. Kim D. Park C. Nicopoulos N. Vijaykrishnan and C. Das
The
G. Hellestrand, J. Torossian and C. Alford
VaST Systems,
A. Leroy1/2, P.Marchal1, F. Robert 2 and F. Catthoor1/3
1 IMEC
2 VUB
3 KUL
A. Vander Biest, A. Leroy and F. Robert
ULB
J.Balachandran1, S.Brebels1, G.Carchon1, M.Kuijk2, W.De Raedt1, B.Nauwelaers 3 and E.Beyne1,
1 IMEC
2 VUB
3 KUL
T. Marescaux1, B. Brickエe1,2, P. Debacker1,2, V. Nollet1, H. Corporaal3
1IMEC V.Z.W.,
2Katholieke
W. Heirmana,
J. Dambrea,
aELIS,
Ghent University,
bLEOM,
Ecole Centrale de Lyon,
K. Lee, S. Lee, D. Kim, K. Kim, J. Kim and H. Yoo
Korea Adv. Inst. of
Science and Technology (KAIST),
S. Fujita1/2, K. Abe1, K. Nomura1 and T. Lee3,
1 Frontier Research
Laboratory, Toshiba,
2 Toshiba
3 Stanford
University,
M. Imai, T. Azuma, K. Watanabe and T. Nanya
Res. Ctr
for Adv. Sci. and Tech., The
M. Al Faruque, X. Ye, G. Weiss and J. Henkel
C. Sauer1, M.
Gries1,
1 Infineon Technologies,
2 HNI
1 EPFL,
2
DACYA/UCM,
F. Regazzoni and M. Lajolo
ALaRI
- USI,
NEC Laboratories
F. Angiolini, D. Atienzaz, S. Murali, L. Benini, G. De Micheli
DEIS,
G. Cappuccino, A. Pugliese, G. Cocorullo
DEIS-University of
E. Bolotin, I.Cidon, R. Ginosar and A.Kolodny
Electrical Engineering
Department, Technion,
Z.
Guz, I. Walter, E. Bolotin,
Electrical Engineering
Department, Technion,
R. Dobkin, R. Ginosar and A. Kolodny
Electrical Engineering
Department, Technion,
I. Walter,
Electrical
Engineering Department, Technion,
K. Goossens
Philips Research, The
14:30-14:45
BREAK
14:45-15:45
Panel: Looking Through
the On-Chip Channels
Moderator: Steve Furber,
15:45-16:30
Planning session for future NoC Symposia
16:30
CLOSE
Organizing Committee: