Testing
Service
。@
Full Range
of Test Service
。@
Production Testing :
。@。@。EWafer Sort (CP)
。@。@。EFinal Test
。@。@。ELead/Ball/Mark Scan
。@。@。EDry-Bake & Packing
。@。@。EEngineering Services
。@。@。EIC Characterization program develop
Back-End Turn-Key / Subcontract :
。@。@。EAssembly。ABurn In。AMarking, Dice Saw,
tape & real
Engineering
Service
。@
- Test strategy consultant
- Test program development
- Test platform conversion
- Test performance optimization
- Multi site test upgrade
- Detail effective low yield analysis
Developing
Test Capability
。@
-
High speed up to 200MHz
(400Mbit available)
。E
Ixxx-
133MHz
。E
Sxxx-
Network Processor : 200MHz
。E
Pxxxx - USB2.0 : 480M bit
。E
Axxx-
LVDS controller : 560M bit
。E
Fx-
Giga bit transceiver controller : 1.25G bit
Currently
Available Solution
PACKAGE
。@
Pin
count
。@
。@
QFN 4x4
24
。@
。@
。@
QFN 4x6
40
。@
。@
。@
QFN 4.5x6.5
46
。@
。@
。@
QFN 5x5
28
32
。@
。@
QFN 6x6
48
。@
。@
。@
QFN 7x7
32
48
64
。@
QFN 8x8
56
68
。@
。@
PACKAGE
。@
Pin
count
。@
。@
QFP 14x20
64
80
100
128
QFP 28x28
160
208
256
。@
QFP 24x24
208
。@
。@
。@
LQFP 20x20
144
160
176
。@
LQFP 24x24
160
176
216
。@
LQFP 14x20
100
128
。@
。@
T/LQFP 7x7
32
48
64
。@
T/LQFP10x10
44
64
80
。@
LQFP 14x14
100
128
。@
。@
。@
。@
。@
。@
。@
PACKAGE
。@
Pin
count
。@
。@
BGA 4.5x6.5
54
。@
。@
。@
BGA 7x7
81
。@
。@
。@
BGA 8x8
64
100
。@
。@
BGA 9x9
100
。@
。@
。@
BGA 10x10
144
。@
。@
。@
BGA 11x11
186
。@
。@
。@
BGA 12x12
144
256
。@
。@
BGA 13x13
308
。@
。@
。@
BGA 13x15
165
。@
。@
。@
BGA 14x22
119
209
。@
。@
BGA 15x15
278
。@
。@
。@
BGA 15x17
165
。@
。@
。@
BGA 16x16
100~209
。@
。@
。@
BGA 17x17
256
208
。@
。@
BGA 20x20
176
。@
。@
。@
BGA 23x23
300
。@
。@
。@
BGA 27x27
256~380
。@
。@
。@
BGA 35x35
388~436
。@
。@
。@
。@
Testing
Equipment Forecast
。@
Time
2023
2024
Total
Tester Model
Q2
Q3
Q4
Q1
Credence SC Series
35
。@
。@
。@
35
Inovys ZFP
1
。@
。@
。@
1
Credence D-10
5
。@
。@
。@
5
Chroma 3600
6
。@
。@
。@
6
Chroma 3360P
9
。@
。@
。@
9
LTX Fusion CX
1
。@
。@
。@
1
ASL1000
4
。@
。@
。@
4
TR6850
5
。@
。@
。@
5
S50
9
。@
。@
。@
9
Total Tester
75
75
75
75
75
ESI-9350(LaserTrim)
2
。@
。@
。@
2
Handler
35
2
。@
。@
37
Prober
22
。@
。@
。@
22
Total
(Handler&Prober)
59
61
61
61
61
。@
Testing
Equipment list
。@
Tester
。@。@& Credence SC Series
。@。@。@。E50/85MHz digital clock rate
。@。@。@。E256 ( Max 304 ) I/O Channels
。@。@。@。E2M/4M Vector Memory
。@。@。@。E128Mb Scan Memory
。@。@。@。EAnalog pin card
。@。@& Inovys ZFP
。@。@。@。ESpeed: 50Mhz / 100Mhz
。@。@。@。EPin Count: 512Pin.(64*8)
。@。@。@。EPattern memory: 16M
。@。@。@。EDPS 105ch,(0~3V 16A),(0~6V 2.5A),(0~16V 0.2A)
。@。@。@。EPMU 8ch,-2~5V range,+-40mA range
& Credence D-10
。@。@。@。E100MHz clock rate
。@。@。@。E200Mbps data rate (Max.)
。@。@。@。E288 / 384 digital channel (576 channel Max.)
。@。@。@。E16M pattern memory / 768M max scan depth
(1
pin/board)
。@。@。@。E16 sets DPS
。EAWG : 8 signal-ended or 4
differential
with
20bits / 300Msps
。EDIG : 4 differential with
16bits / 2.5Msps
and 14bits /
100Msps
& Chroma 3600
。@。@。@。E50/100MHz / 256Pin
。@。@。@。E16M Pattern memory
。@。@。@。EOver timer accuracy 850ps
。@。@。@。EDPS 8ch (+/- 8V, 2A)(+/- 16V, 0.8A)
。@。@。@。EPMU 4ch
。EADDA 4ch /16bit
。@。@。@。EALPG 12X, 12Y, 32D
& Chroma 3360P
。@。@。@。ETest rate 50MHz 256pin (32*8)
。@。@。@。EOver timing accuracy +/- 1.25ns
。@。@。@。E8M pattern memory (option 16M)
。@。@。@。EDPS 8ch (+/-10V, 2A)
。@。@。@。EOption UVI 16ch (+/- 10V, 500mA)
。EPMU 16ch
。@。@。@。EPPMU per pin
。@。@。@。EALPG 16X, 16Y, 16D
。EADDA 4AWG(16bit) / 4Digizer
(16bit)
& LTX Fusion CX
。@。@。@。E80MHz clock rate
。@。@。@。EPatern Gen. rate 33MHz
。@。@。@。E128 digital channel (8M pattern memory)
。@。@。@。EOVI 8ch (+/- 16V, 1A)
。@。@。@。EVI16B 16ch (+16 to - 4V, 100mA)
。EAWG。G2ch with 14bits / 25Msps
。@。@。@。EDIG。G2ch with 14bits / 25Msps
。@。@。@。ERF16。G16ports (10MHz to 6GHz)
& ASL1000
。@。@。@。E14Mhz clock rate
。@。@。@。EInstrument list。G
。@。@。@ OVI。G。モ15V range
DVI。G。モ45V force range, differential
voltage measure capable
MUX。GVoltage range 200V / 500V
TMU。GTiming range of 2s to 10ns
PV3。GFully floating output
DDD。G320 KHz to 14 MHz
ACS。GSimple waveform generator
& TR6850
。@。@。@。EOVC。G8 ch, 。モ20V renge, 。モ200mA range
。@。@。@。EQVC。G4 ch, 。モ45V renge, 。モ1A range
。@。@。@。EPEB32。G32 ch, 33Mhz, 4M pattern Memory,
Level set -2~8V 。モ40mA range
。@。@。@。ETMU。G4 Set (A,B,HiZ,Trig 4ch/set),
625ps resolution, 80ch UR control bit
。@。@& S50
。@。@。@。ELOGIC *1。G
64ch (8PMU), 50Mhz, 17M Pattern memory,
-2~7V range.2DPS, 10V range, 1.73A range.
1TMU, -2~10V range, 5ns resolution.32CBIT,
5V, 60mA.
。@。@。@。EOPM *3。G
8 ch, -15~38V renge, 。モ1A range.32CBIT,
5V, 60mA.
。@。@& ESI-9350(Laser Trim)
。@。@。@。EWavelength。G1.3 」gm (IR)
。@。@。@。EMaximum Laser Pulse Equalization Rep Rate。G6 KHz
。@。@。@。EProgrammable Spot Size。G2.3 」gm ~ 6.0 」gm
。@。@。@。EMaximum setting of Energy level per pulse。G6.0 」gj
。@。@。@。ESize of Wafer。G150 mm ( 6。ィ) & 200 mm ( 8。ィ)
Handler
。@。@& NS-5000, NS-6000
。@。@。@。EPackage type。GQFP, TQFP, TSOP, SOP,
PLCC, BGA, µ
BGA, CSP
。@。@。@。ETemperate。G50 to 90oC (Option。G90 to 130oC)
。@。@。@。EUp to 2 test site handling
。@。@。@。ESuperiority throughput and reliability
。@。@&Hitachi
。@。@。@。EPackage type。GQFP, TQFP, TSOP, SOP,
PLCC, BGA, µ
BGA, CSP
。@。@。@。ETemperate。G50 to 90oC(Option。G90 to 130oC)
。@。@。@。EUp to 4 test site parallel testing
。ESuperiority throughput and
reliability
。@。@& Multitest MT8589 / 8305L
。@。@。@。EPackage Type : TSOP , PLCC, PDIP, SOJ
。@。@。@。ETemperate : Room temp to 130oC
。@。@。@。E2 test site handling
。ESuperiority throughput and
reliability
Probing Station
。@。@&TSK UF200 / UF200AL
。@。@。@。EWafer Thickness 150 to 1000」gm
。@。@。@。EWafer Size 5 , 6 , 8 Inches
。@。@。@。ETotal Accuracy : 5」gm
。@。@。@。EWafer Mapping
。@。@。@。ENetworking
。EHot temp
。@