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Miniaturizing the
Future, Sustainably

Sustainable Tech,
Miniaturized

Powering the Future
Efficiently

About Micromize, Inc.

Micromize, Inc. is an MIT-spinoff startup revolutionizing the tech industry with sustainable electronics manufacturing. Our expertise in miniaturized electronics and semiconductor packaging enables us to develop energy-efficient electronics that enhance performance while increasing battery life in mobile devices and AI hardware.

Our Product Innovation

At Micromize, we push the boundaries of miniaturized electronics with a relentless focus on innovation, efficiency, and sustainability. Our expertise includes:

AI Hardware Innovation

  • AI Chip Packaging
  • Chiplets Integration
  • Edge-AI Hardware
  • AI-System-In-Package (SiP)

High-Density & Miniaturized Electronics

  • Ultra-High Density Rigid & Flex PCBs
  • PCB Assembly
  • PCB Inspection & Testing
  • Miniaturized Flex Cables & Connectors
  • Probe Cards, Burn-in Boards, Load Boards, and Test Interface Boards

Semiconductor Packaging

  • Fan-Out Packaging
  • Heterogeneous Integration
  • OSAT Services
  • IC Substrate (Interconnect Substrate)
  • Substrate-like PCB

R&D & Prototyping Services

  • Design Services
  • Proof-of-Concept
  • First Verification Article
  • Feasibility Test

Environment-Friendly &
Energy-Efficient Solutions

We prioritize sustainability in electronics by integrating eco-friendly materials and advanced energy-saving technologies. Our mission is to create energy-efficient electronics that not only enhance device performance but also contribute to a greener planet.

Our Value Proposition

We don’t just build technology—we take a bold, forward-thinking approach to creating breakthrough solutions that reshape industries and unlock new possibilities for our partners. With deep expertise and a commitment to pushing boundaries, we are the ideal partner for those looking to stay ahead in a rapidly evolving landscape.

Chip-on-Board with High-Density Routing

Chip-on-Board with High-Density Routing

Decreased Layers and Vias in Substrate

Faster development and less time spent debugging.

Choice of
Material

FR-4, Ceramic, Aluminum, etc.

US-Based Manufacturing

Reduced risk of supply chain disruption. Supply chain diversification.

Low Volume, Fast Turnaround

Rapid Prototyping and iterative improvement.

Environmental Friendly Manufacturing

Reduce chemical usage by up to 70%.

Join Micromize, Inc.—We’re Growing!

We're expanding and actively hiring for multiple roles. Explore opportunities and apply below.

Partner
With Us

A next-generation manufacturing solution that surpasses conventional constraints.

01

CONCEPT

Get started by defining your product requirements.

02

IDEATION

Partner with our design experts to exceed traditional manufacturing limitations

03

RESEARCH

Our team rapidly develops and iterates solutions

04

PRODUCTION

We manufacture the product for you in our facility based in the USA

Industries We Serve

AI Hardware, Semiconductor Packaging & Testing

Wearables & Medical

Defense

We Are Powering The Next Generation Of Tech
Be A Part Of It.

Let’s Craft Smarter, Lighter, Faster Tech Together

Miniaturizing the Future, Sustainably.

Contact Info

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