Enabling 5G Connectivity

5G generates greater demand for higher quality, reliable electronics

Enhanced Mobile Broadband

Advanced semiconductor ICs with leading edge technologies, smaller design nodes and increased complexity are at the core of the mobile devices that serve the 5G network’s faster connections, higher data rates and enhanced capacity.

Ultra-Reliable Communications

The 5G network supports ultra-reliable, low latency communications for mission-critical applications such as autonomous driving, remote patient monitoring and smart power grids. High performance, high reliability electronics and semiconductor ICs maintain robust, uninterrupted data exchange.

Massive Networks

High performing, reliable sensors and innovative packaging architectures enable 5G’s massive machine-to-machine communications, connecting the low power devices that form the backbone of smart homes, smart cities, Industry 4.0 and IoT.

Industry 4.0

Leading-edge manufacturing is getting smarter. 5G supports the applications required to transform automation and implementation of artificial intelligence driving the next level of autonomy in manufacturing.

How KLA enables 5G

5G delivers much more than a faster browsing experience to your mobile device. 5G networking technology is critical to enabling how independent systems interact synergistically with each other. Coupled with innovations in artificial intelligence (AI), 5G is changing how our world works, how we communicate, and how information flows in business and our personal lives. For example, automobile vehicle to everything (V2X) communication technology utilizes 5G to improve safety and help with traffic management by constantly monitoring and communicating with the surroundings. In addition, KLA’s technologies enable the manufacture of thinner and lighter advanced displays that are an essential part of many 5G devices.

KLA’s products are used at every stage in the 5G component manufacturing process, from R&D through high-volume production of ICs, packages and PCBs, to ensure the highest quality and reliability standards are achieved.

KLA Products

Integrated Circuit Quality

Semiconductor IC quality is fundamental to the success of mission-critical, low‐latency 5G services such as autonomous driving and security monitoring. High chip reliability and performance are achieved through implementation of comprehensive process control strategies across the semiconductor ecosystem.

IC Process Control

Packaging Inspection

Semiconductor Manufacturing

5G applications are driving increased adoption of electronic devices that utilize RF power amplifiers and high-frequency filters, sensors and MEMS devices. Robust IC process technologies and process control strategies improve chip performance and reliability.

Specialty Semiconductor Etch Processes

Specialty Semiconductor Deposition Processes

Packaging Advances

New IC packaging architectures with complex levels of integration—system in package (SiP) and fan-out on both wafer and panel—enable the development of 5G devices. Process technologies, including etch, PVD, CVD, and UV laser drilling support the formation of these complex packaging schemes. During packaging processing and after component formation, tighter quality requirements drive the need for accurate inspections at the wafer, die and sub-package levels.

Component Inspection

Wafer-Level Packaging (WLP) Inspection

Packaging Processing

High Density Interconnect PCB

5G-enabled devices require advanced printed circuit boards with finer linewidths, straight sidewall geometry and multiple layers with more stringent quality and reliability requirements. PCB inspection, repair and imaging systems help manufacturers find and repair defective layers and trace the source of defects, increasing the yield and reliability of finished PCBs.

PCB Inspection and Metrology

PCB Repair

PCB Imaging

5G Highlights

Innovation

Automotive Innovations, Trends Semiconductors

Jun 15, 2021

The semiconductor industry performed better than expected in 2020 despite the impact of COVID-19 on the global economy...

Innovation

Orbotech's Frontline Accelerates Time to Market

Mar 16, 2021

Today’s PCB (printed circuit board) engineering departments face many challenges in their process planning, including long and complex planning cycles,...

Innovation

New Orbotech Solutions Enable Next-Gen Electronics

Nov 30, 2020

As 5G smartphones, advanced automotive electronics, medical and WFH/LFH (learn-from-home) devices become lighter in weight, smaller in form factor and...

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