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Photonics packaging and integration VI : 25-26 January, 2006, San Jose, California, USA / Allen M. Earman, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering. -- Bellingham, Wash. : SPIE , c2006. -- 1 v. (various pagings) : ill. ; 28 cm. -- (Proceedings / SPIE -- the International Society for Optical Engineering ; v. 6126). -- Some earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration ; Includes bibliographical references and author index. -- ISBN 0819461687 ; (BC07803282) ; https://ci.nii.ac.jp/ncid/BC07803282
Other Title(s): Photonics packaging and integration 6 ; Optoelectronic interconnects. Photonics packaging and integration. -- Author Heading(s): Earman, Allen M. ; Chen, Ray T. ; Society of Photo-optical Instrumentation Engineers. -- Classification(s): LCC : TK7874 ; DC22 : 621.36. -- Subject Heading(s): LCSH : Microelectronic packaging -- Congresses ; LCSH : Optoelectronic devices -- Design and construction -- Congresses ; LCSH : Optical interconnects -- Congresses ; LCSH : Photonics -- Congresses
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