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Photonics packaging and integration V : 27 January, 2005, San Jose, California, USA / Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering. -- pbk.. -- Bellingham, Wash. : SPIE , c2005. -- v, 136 p. : ill. ; 28 cm. -- (Proceedings / SPIE -- the International Society for Optical Engineering ; v. 5731). -- Some earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration ; Includes bibliographical references and author index. -- ISBN 0819457051 ; (BC07803238) ; https://ci.nii.ac.jp/ncid/BC07803238
Other Title(s): Photonics packaging and integration 5 ; Optoelectronic interconnects. Photonics packaging and integration. -- Author Heading(s): Heyler, Randy A. ; Chen, Ray T. ; Society of Photo-optical Instrumentation Engineers. -- Classification(s): LCC : TA1750 ; DC22 : 621.36. -- Subject Heading(s): LCSH : Optoelectronic devices -- Design and construction -- Congresses ; LCSH : Optical interconnects -- Congresses ; LCSH : Microelectronic packaging -- Congresses ; LCSH : Photonics -- Congresses
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