Mechanics and materials for electronic packaging : volume 2. thermal and mechanical behavior and modeling : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

• • American Society of Mechanical Engineers. Applied Mechanics Division
• • American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• • American Society of Mechanical Engineers. Materials Division
• • American Society of Mechanical Engineers. Production Engineering Division
• • Japan Society of Mechanical Engineers. Materials and Mechanics Division
• • Japan Society of Mechanical Engineers. Computational Mechanics Division
• • Schen, Michael A.

• 関連文献: 1件

• • American Society of Mechanical Engineers. Applied Mechanics Division
• • American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• • American Society of Mechanical Engineers. Materials Division
• • American Society of Mechanical Engineers. Production Engineering Division
• • Japan Society of Mechanical Engineers. Materials and Mechanics Division
• • Japan Society of Mechanical Engineers. Computational Mechanics Division
• • Schen, Michael A.

Mechanics and materials for electronic packaging : volume 2. thermal and mechanical behavior and modeling : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

co-sponsored by the Applied Mechanics, Electrical and Electronic Packaging, Materials, and Production Engineering Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME ; edited by M.A. Schen ... [et al.]

(AMD, vol. 187)

American Society of Mechanical Engineers, c1994

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  A11615/942714109427144

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  AMD

  American Society of Mechanical Engineers