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Thermomechanical couplings in solids : Jean Mandel memorial symposium, Paris France, 1-5 September, 1986 / edited by H.D. Bui and Q.S. Nguyen. -- Amsterdam ; Tokyo : North-Holland ; New York, N.Y., U.S.A. : Sole distributors for the U.S.A. and Canada, Elsevier Science Pub. Co. , 1987. -- xiii, 425 p. : ill. ; 24 cm. -- Lectures presented at the I.U.T.A.M. Symposium on "Thermomechanical Couplings in Solids," held in Paris, Sept. 1986. -- ISBN 0444702369 ; (BA00618991) ; https://ci.nii.ac.jp/ncid/BA00618991
Author Heading(s): Mandel, Jean-Jacques ; Bui, Huy Duong ; Nguyen, Q. S. ; International Union of Theoretical and Applied Mechanics ; IUTAM Symposium on Thermomechanical Couplings in Solids. -- Classification(s): LCC : TA418.58 ; DC19 : 620.1/121. -- Subject Heading(s): LCSH : Thermal stresses -- Congresses ; LCSH : Thermoelasticity -- Congresses ; LCSH : Coupled problems (Complex systems) -- Congresses ; LCSH : Materials -- Testing -- Congresses
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