sponsored by IEEE Dielectrics and Electrical Insulation Society ; cosponsored by IEE Japan

IEEE Service Center c2003

v. 1 , v. 2 , v. 3

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sponsored by IEEE Dielectrics and Electrical Insulation Society ; with technical co-sponsorship by China Electrical Society ; organized by Xi'an Jiaotong University CES Engineering Dielectric Institution

Institute of Electrical and Electronics Engineers c2000

: set casebound , : set softbound , v. 1 , v. 2

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sponsored by IEEE Dielectrics and Electrical Insulation Society ; organized by the Korean Institute of Electrical and Electronic Material Engineers

Institute of Electrical and Electronics Engineers c1997

v. 1 : softbound , v. 1 : casebound , v. 2 : softbound , v. 2 : casebound

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sponsored by IEEE Dielectrics and Electrical Insulation Society

Institute of Electrical and Electronics Engineers c1994

v. 1 :softbound , v. 1 :casebound , v. 2 :softbound , v. 2:casebound

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sponsored by IEEE Dielectrics and Electrical Insulation Society, Institute of Electrical Engineers of Japan, Waseda University

Institute of Electrical and Electronics Engineers c1991

v. 1 , v. 2

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Tsinghua University Press 1988

vol. 1 , vol. 2

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cosponsored by the Xían Jiaotong University, China, IEEE Society on Electrical Insulation, Chinese Electrotechnical Society--Dielectric Committee

Institute of Electrical and Electronics Engineers c1985

v. 1 , v. 2

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