A cool fix for hot chips: advanced thermal management technology for electronic devices - Institute of Industrial Science, the University of Tokyo

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A cool fix for hot chips: advanced thermal management technology for electronic devices
A cool fix for hot chips: advanced thermal management technology for electronic devices

[画像:三次元マイクロ流路で半導体チップの省エネ水冷を実現(1200_800).jpg]

Researchers from the Institute of Industrial Science, The University of Tokyo, have demonstrated a significant performance increase in cooling technology for high-power electronic devices. They designed novel capillary geometries that push the boundaries of thermal transfer efficiency. This study could play a crucial role in the development of next-generation technology.

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