IBIS Open Forum

IBIS_logo
Welcome to the IBIS Open Forum
NEW IBIS Version 8.0 draft Available for review!
NEW 2025 Hybrid IBIS Summit @ IEEE EMC SPI Agenda and Presentations
NEW TSCHK2.1.0 parser is released and available for free executable download
NEW Touchstone 2.1 Specification is approved and available for download
I/O Buffer Information Specification (IBIS 7.2) (SAE/EIA-STD-656-B) (IEC-62014-1)
IBIS Interconnect Modeling Specification (ICM 1.1) (SAE/GEIA-STD-0001)
IBIS Interconnect SPICE Subcircuit Specification (IBIS-ISS 1.0)
Touchstone® File Format Specification (Touchstone 2.1)
The IBIS Open Forum is the industry organization responsible for the management of the IBIS specifications and standards including IBIS, IBIS-AMI, IBIS-ISS, ICM, and Touchstone. The Open Forum meets every three weeks by teleconference. Membership is open to all interested companies. If you are interested in joining the IBIS Open Forum, please contact the IBIS Open Forum Chair or any of the IBIS Officers.

No web cookies are used by ibis.org.

©1995-2025, IBIS Open Forum
Website since 1995, updated 25 Jan 2025
Comments or suggestions? Send E-mail to:Webmaster.

AltStyle によって変換されたページ (->オリジナル) /